Automated Optical Inspection Systems
FX-940 AOI System
The FX-940 automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.
Features:
- Propiertary megapixel color imaging.
- Capture o the fly technology.
- 1 top-down and 4 side angle cameras.
- Quick set-up.
- High speed.
- High defect coverage/low false failure.
- Optional 3D inspection.
Automated In-line AOI System PCB Inspection
- Megapixel color imaging.
- Capture on the fly technology.
- 1 top-down & 4 side angle cameras.
- Quick set-up.
- High speed.
- High defect coverage / low false failure rate.
- Optional 3D inspection.
Programming the FX-940 AOI system is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-940 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.
FX-940 ULTRA 3D AOI
Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top-down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Features:
- 5 axis 3D NYTVISION Technology.
- Advanced 2D + 3D inspection.
- Multi-fringe digital projection.
- 1 top-down and 4 side viewing cameras.
- Automatic Z Focus.
- Automatic programming tools: <30 minutes.
- SPI Module.
- High defect coverage/low false failure.
- SPC data collection and reporting.
- Optional Ultra high-resolution 3D sensor.
Automated In-line 3D AOI System PCB Inspection
- 5 axis 3D NYT VISION Technology.
- Advanced 2D + 3D inspection.
- Multi-fringe digital projection.
- 1 top-down and 4 side viewing cameras.
- Automatic programming tools: < 30 minutes.
- High defect coverage / low false failure.
- PC data collection & reporting.
Programming the FX-940 ULTRA is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder and lead inspections. The FX-940 ULTRA utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.
FX-942 AOI System
The FX-942 dual-sided automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.
Features:
- Dual-sided imaging with full travel imaging.
- 1 vertical and 4 optional angle cameras per side.
- Up to 100mm clearance.
- High-speed inspection and transfer.
- High defect coverage/low false failure.
- Picture in Picture (P-in-P) feature.
- MES/Industry 4.0 compatible.
In-line Dual Sided Optical Inspection
- Dual-sided imaging with full travel imaging sensors
- 1 vertical and 4 optional angle cameras per side
- Up to 100 mm clearance
- High-speed inspection and transfer
- High defect coverage / low false failure
- Picture in Picture (P-in-P) feature
- MES / Industry 4.0 compatible
FX-940 AOI System
The FX-940 automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.
Features:
- Propiertary megapixel color imaging.
- Capture o the fly technology.
- 1 top-down and 4 side angle cameras.
- Quick set-up.
- High speed.
- High defect coverage/low false failure.
- Optional 3D inspection.
Automated In-line AOI System PCB Inspection
- Megapixel color imaging.
- Capture on the fly technology.
- 1 top-down & 4 side angle cameras.
- Quick set-up.
- High speed.
- High defect coverage / low false failure rate.
- Optional 3D inspection.
Programming the FX-940 AOI system is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-940 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.
FX-940 ULTRA 3D AOI
Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top-down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Features:
- 5 axis 3D NYTVISION Technology.
- Advanced 2D + 3D inspection.
- Multi-fringe digital projection.
- 1 top-down and 4 side viewing cameras.
- Automatic Z Focus.
- Automatic programming tools: <30 minutes.
- SPI Module.
- High defect coverage/low false failure.
- SPC data collection and reporting.
- Optional Ultra high-resolution 3D sensor.
Automated In-line 3D AOI System PCB Inspection
- 5 axis 3D NYT VISION Technology.
- Advanced 2D + 3D inspection.
- Multi-fringe digital projection.
- 1 top-down and 4 side viewing cameras.
- Automatic programming tools: < 30 minutes.
- High defect coverage / low false failure.
- PC data collection & reporting.
Programming the FX-940 ULTRA is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder and lead inspections. The FX-940 ULTRA utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.
FX-942 AOI System
The FX-942 dual-sided automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.
Features:
- Dual-sided imaging with full travel imaging.
- 1 vertical and 4 optional angle cameras per side.
- Up to 100mm clearance.
- High-speed inspection and transfer.
- High defect coverage/low false failure.
- Picture in Picture (P-in-P) feature.
- MES/Industry 4.0 compatible.
In-line Dual Sided Optical Inspection
- Dual-sided imaging with full travel imaging sensors
- 1 vertical and 4 optional angle cameras per side
- Up to 100 mm clearance
- High-speed inspection and transfer
- High defect coverage / low false failure
- Picture in Picture (P-in-P) feature
- MES / Industry 4.0 compatible