Automated Optical Inspection Systems

FX-940 AOI System

The FX-940 automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.

Features:

  • Propiertary megapixel color imaging.
  • Capture o the fly technology.
  • 1 top-down and 4 side angle cameras.
  • Quick set-up.
  • High speed.
  • High defect coverage/low false failure.
  • Optional 3D inspection.

Automated In-line AOI System PCB Inspection

  • Megapixel color imaging.
  • Capture on the fly technology.
  • 1 top-down & 4 side angle cameras.
  • Quick set-up.
  • High speed.
  • High defect coverage / low false failure rate.
  • Optional 3D inspection.

Programming the FX-940 AOI system is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-940 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.


FX-940 ULTRA 3D AOI

Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage.  With one top-down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

Features: 

  • 5 axis 3D NYTVISION Technology.
  • Advanced 2D + 3D inspection.
  • Multi-fringe digital projection.
  • 1 top-down and 4 side viewing cameras.
  • Automatic Z Focus.
  • Automatic programming tools: <30 minutes.
  • SPI Module.
  • High defect coverage/low false failure.
  • SPC data collection and reporting.
  • Optional Ultra high-resolution 3D sensor.

Automated In-line 3D AOI System PCB Inspection

  • 5 axis 3D NYT VISION Technology.
  • Advanced 2D + 3D inspection.
  • Multi-fringe digital projection.
  • 1 top-down and 4 side viewing cameras.
  • Automatic programming tools: < 30 minutes.
  • High defect coverage / low false failure.
  • PC data collection & reporting.

Programming the FX-940 ULTRA is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder and lead inspections. The FX-940 ULTRA utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.


FX-942 AOI System

The FX-942 dual-sided automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.

Features:

  • Dual-sided imaging with full travel imaging.
  • 1 vertical and 4 optional angle cameras per side.
  • Up to 100mm clearance.
  • High-speed inspection and transfer.
  • High defect coverage/low false failure.
  • Picture in Picture (P-in-P) feature.
  • MES/Industry 4.0 compatible.

In-line Dual Sided Optical Inspection

  • Dual-sided imaging with full travel imaging sensors
  • 1 vertical and 4 optional angle cameras per side
  • Up to 100 mm clearance
  • High-speed inspection and transfer
  • High defect coverage / low false failure
  • Picture in Picture (P-in-P) feature
  • MES / Industry 4.0 compatible

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FX-940 AOI System

The FX-940 automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.

Features:

  • Propiertary megapixel color imaging.
  • Capture o the fly technology.
  • 1 top-down and 4 side angle cameras.
  • Quick set-up.
  • High speed.
  • High defect coverage/low false failure.
  • Optional 3D inspection.

Automated In-line AOI System PCB Inspection

  • Megapixel color imaging.
  • Capture on the fly technology.
  • 1 top-down & 4 side angle cameras.
  • Quick set-up.
  • High speed.
  • High defect coverage / low false failure rate.
  • Optional 3D inspection.

Programming the FX-940 AOI system is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-940 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.


FX-940 ULTRA 3D AOI

Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage.  With one top-down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

Features:

  • 5 axis 3D NYTVISION Technology.
  • Advanced 2D + 3D inspection.
  • Multi-fringe digital projection.
  • 1 top-down and 4 side viewing cameras.
  • Automatic Z Focus.
  • Automatic programming tools: <30 minutes.
  • SPI Module.
  • High defect coverage/low false failure.
  • SPC data collection and reporting.
  • Optional Ultra high-resolution 3D sensor.

Automated In-line 3D AOI System PCB Inspection

  • 5 axis 3D NYT VISION Technology.
  • Advanced 2D + 3D inspection.
  • Multi-fringe digital projection.
  • 1 top-down and 4 side viewing cameras.
  • Automatic programming tools: < 30 minutes.
  • High defect coverage / low false failure.
  • PC data collection & reporting.

Programming the FX-940 ULTRA is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder and lead inspections. The FX-940 ULTRA utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.


FX-942 AOI System

The FX-942 dual-sided automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.

Features:

  • Dual-sided imaging with full travel imaging.
  • 1 vertical and 4 optional angle cameras per side.
  • Up to 100mm clearance.
  • High-speed inspection and transfer.
  • High defect coverage/low false failure.
  • Picture in Picture (P-in-P) feature.
  • MES/Industry 4.0 compatible.

In-line Dual Sided Optical Inspection

  • Dual-sided imaging with full travel imaging sensors
  • 1 vertical and 4 optional angle cameras per side
  • Up to 100 mm clearance
  • High-speed inspection and transfer
  • High defect coverage / low false failure
  • Picture in Picture (P-in-P) feature
  • MES / Industry 4.0 compatible

Go Back