Solder Paste Inspection Equipment


Nordson YESTECH’s FX-500 ULTRA 3D SPI provides 3-D height, volume, and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability.



  • High Accuracy at Faster Speed.
  • Full “on the fly” 3D solder paste metrology.
  • Feedback, Feed Forward Ready (I 4.0).
  • Propiertary strobe lightning.
  • Built-in barcode reading for traceability.
  • Intuitive software with touch screen programming.

Automated 3D Inspection for:

  • Solder Paste Area coverage.
  • Solder Paste Volume.
  • Solder Paste Registration.
  • Solder Paste Bridge Detection.
  • Automated Defect Review.
  • SPC, barcode reading and archiving of board image with inspection results.

Go Back