Solder Paste Inspection Equipment
FX-500 ULTRA 3D SPI
Nordson YESTECH’s FX-500 ULTRA 3D SPI provides 3-D height, volume, and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability.
Features:
- High Accuracy at Faster Speed.
- Full “on the fly” 3D solder paste metrology.
- Feedback, Feed Forward Ready (I 4.0).
- Propiertary strobe lightning.
- Built-in barcode reading for traceability.
- Intuitive software with touch screen programming.
Automated 3D Inspection for:
- Solder Paste Area coverage.
- Solder Paste Volume.
- Solder Paste Registration.
- Solder Paste Bridge Detection.
- Automated Defect Review.
- SPC, barcode reading and archiving of board image with inspection results.