Nordson YESTECH’s FX-500 ULTRA 3D SPI provides 3-D height, volume, and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability.
Features:
High Accuracy at Faster Speed.
Full “on the fly” 3D solder paste metrology.
Feedback, Feed Forward Ready (I 4.0).
Propiertary strobe lightning.
Built-in barcode reading for traceability.
Intuitive software with touch screen programming.
Automated 3D Inspection for:
Solder Paste Area coverage.
Solder Paste Volume.
Solder Paste Registration.
Solder Paste Bridge Detection.
Automated Defect Review.
SPC, barcode reading and archiving of board image with inspection results.